Products
Home > Products > Thermal Compound > Formula 7
Formula 7
Nano Diamond Thermal Compound
Click below to view different view
ModelUPC# 

Formula 7

0761345-77061-3

A diamond-caliber solution

Antec's Formula 7 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 7's nano diamond particles minimize the distance between heat-conductive compounds and gladly take on an overclocking environment, optimally performing between -50°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec's Formula 7 for a diamond-caliber solution.
Features:

  • Diamond particles measuring 0.0000015 cm rated at 8.3 w/mK
  • Extended -50°C to 250°C stable temperature range ideal for performance cooling
  • Lighter, easier to spread stable composition won’t crack or dry out
  • Quantity: 4 g
  • Specific gravity: 2.8 g/cm3
  • Antec Advance
    Thermal Compound